Provide wire bond solution for any new project & device extension with different material used. Ex. Au, Cu etc
Working with various project managers to meet the wire bond process optimization timeline for each project. Discussion with Customer thru email or call for wire bond related subject if case needed.
Design feasibility – Review Customer Wafer & bond Pad Metallization & Dimension to recommend suitable capillary type & wire bonding parameter for DOE.
Knowledge on Problem solving, Process capability study, Material technology, Equipment engineering, FMEA/ 4M/ 8D/ DOE/ SPC, etc.
Provide support to products & devices during Engineering / Qual runs to meet & align to process optimization report and customer requirement.
Semiconductor Assembly Packaging Wire bond process for more than 10 years.
Wire bond machine indexing mechanism to support any special product requirement
Wire bond material & capillary selection for different bond pad structure
Upstream process knowledge ex. Die attach to in order to identify potential material risk to wire bond process